PACK EXPO International: ETG Booth
| Date: | Nov 03, 2024 - Nov 06, 2024 |
| Location: | Chicago (IL), USA |
| Venue: | McCormick Place |
| Hall, Booth: | Lakeside Upper, 8045 |
| Type: | Tradeshow |
| Web address: | www.packexpointernational.com |
| Further information: |
ETG participates in the PACK EXPO International, the world’s most comprehensive packaging and processing event this year. Visit our EtherCAT experts at booth LU-8045 from November 3 - 6! |