Modular Device Profile (MDP)

The Modular Device Profile (MDP) defines a modelling of structures within in a device. Mainly the object dictionary structure and corresponding behaviour of the entries is defined by the MDP. The intention is to provide an easy way for master and configuration tools to handle the devices.

A modular structure can be used for all kind of devices that supports physical or logical modules. This can be for example:

  • Gateways from Fieldbusses to EtherCAT
  • Multi Axis servo drives (physical modules) with each axis having independent operation modes (logic modules)
  • Extendable bus coupler with an internal backbone (e.g. sliced I/Os)

The MDP specification is divided in the following subparts:

  • ETG.5001.1: General MDP Device Model
  • ETG.5001.4: MDP Safety Module Specification
  • ETG.5001.x: MDP Module Specification (x represents the Module Profile number)

You may not copy, distribute or “mirror” the files or printed versions of the documents, or any part of it, without permission in writing from the ETG (EtherCAT Technology Group).

  描述 语言 类别 日期 大小 版本 状态
仅供会员members-yes ETG.5001 Modular Device Profile (MDP) EN DOC 2017年2月14日 Draft for Review 
仅供会员members-yes ETG.5001.1 General MDP Device Model Specification EN  PDF  2016年2月17日  0,77 MB 0.9.0  Draft 
仅供会员members-yes ETG.5001.2.800 Vision Sensor Profile EN  ZIP  2013年10月9日  0,55 MB 0.5.2  Draft 
仅供会员members-yes ETG.5001.3 MDP Fieldbus Gateway Profile Specification EN  PDF  2016年8月5日  2,18 MB 0.1.2  Draft 
仅供会员members-yes ETG.5001.4 MDP Safety Module Specification EN  PDF  2017年8月14日  0,57 MB 1.0.0  Release 
members-no ETG.5001.6220 MDP IO-Link Master EN  PDF  2017年5月2日  0,44 MB 1.0.5  Release 
仅供会员members-yes TF-4401 IO Link Profile Test File Set EN  ZIP  2017年7月12日  0,06 MB 1.1.0  Release 
仅供会员members-yes ETG.5001 Comment Form EN  DOC  2016年2月17日  0,03 MB