Modular Device Profile (MDP)
The Modular Device Profile (MDP) defines a modelling of structures within in a device. Mainly the object dictionary structure and corresponding behaviour of the entries is defined by the MDP. The intention is to provide an easy way for MainDevice and configuration tools to handle the SubDevices.
A modular structure can be used for all kind of devices that supports physical or logical modules. This can be for example:
- Gateways from Fieldbusses to EtherCAT
- Multi Axis servo drives (physical modules) with each axis having independent operation modes (logic modules)
- Extendable bus coupler with an internal backbone (e.g. sliced I/Os)
The MDP specification is divided in the following subparts:
- ETG.5001.1: General MDP Device Model
- ETG.5001.x: MDP Module Specification (x represents the Module Profile number)
- ETG.5001.4: MDP Safety Module Specification
| 描述 | 语言 | 类别 | 日期 | 大小 | 版本 | 状态 | |
|---|---|---|---|---|---|---|---|
 |
ETG.5001.1 General MDP Device Model Specification | EN | 2025年5月5日 | 0,61 MB | 1.0.0 | Release | |
|
ETG.5001.2.800 Vision Sensor Profile | EN | ZIP | 2013年10月9日 | 0,55 MB | 0.5.2 | Draft for Review |
|
ETG.5001.3 MDP Fieldbus Gateway Profile Specification | EN | 2016年8月5日 | 2,18 MB | 0.1.2 | Draft for Review | |
|
ETG.5001.4 MDP Safety Module Specification | EN | 2020年7月15日 | 0,47 MB | 1.1.0 | Release | |
|
ETG.5001.6220 MDP IO-Link Master | EN | 2017年5月2日 | 0,44 MB | 1.0.5 | Release | |
|
ETG.5001.6220 MDP IO-Link Master Specification | EN | ZIP | 2025年3月21日 | 0,40 MB | 1.0.5.1 | Draft for Review |
|
ETG.5001 Comment Form | EN | DOC | 2016年2月17日 | 0,03 MB |
You may not copy, distribute or “mirror” the files or printed versions of the documents, or any part of it, without permission in writing from the ETG (EtherCAT Technology Group).